Intel Processes 30,000 Wafers with New High-Na Euv Lithography Machines
Intel has successfully integrated ASML's High-NA EUV lithography machines, processing 30,000 wafers in a single quarter. This marks a strategic turnaround from Intel's previous seven-year delay with earlier EUV technology, now achieving an 8nm resolution that reduces manufacturing complexity. The company recently managed to integrate two state-of-the-art ASML High-NA EUV lithography machines into its production line.
- The integration of these advanced systems demonstrates Intel's ability to rapidly adapt and overcome technological challenges, which could be a significant advantage in the highly competitive semiconductor industry.
- Will this technological leap enable Intel to regain its manufacturing edge in the global chip market, or will it face continued pressure from rivals like TSMC?