Samsung Signs Patent Deal to Use China's YMTC Bonding Tech
YMTC, a Chinese storage company, holds critical patent on bonding technology essential for 400-layer NAND. Samsung has signed an agreement with YMTC to use its hybrid bonding tech, preventing infringement claims in production of 400-layer NAND. The deal may be influenced by US-China trade tensions, which have impacted YMTC's ability to sell memory components outside China.
- This strategic move highlights the growing importance of partnerships and licensing agreements in the semiconductor industry, particularly among global leaders competing for market share.
- How will this technology transfer impact the global NAND flash memory landscape, potentially shifting power dynamics between China and established players like Samsung?